Da-Yung Wang

SurfTech Corp., Taiwan ｜ Chief Technical Officer

就業狀態

Employment
【1987-12~1990-07】Argonne National Laboratory:Lemont, IL, US
【1990-08~1993-07】National Chung Hsing University:Taichung, TW
【1993-08~1994-07】National Chung Hsing University:Taichung, TW
【2020-02~NOW】SurfTech Corp.:Taichung, TW
【2020-02~NOW】Aurora Scientific Corp.:Richmond, British Columbia, CA
【1994-08~2001-07】National Chung Hsing University:Taichung, TW
【2020-02~NOW】MingDao University:Changhua, TW

教育與認證

Education and qualifications
【1976-09~1980-06】National Tsing Hua University:Hsinchu, TW
【1982-09~1997-01】The Ohio State University:Columbus, OH, US

成果

Works
Patent List:
D.Y. Wang, 1999, “Synthesis of Diamond-like Carbon Film by Cathodic Arc-Activated PECVD Process”, Taiwan. Patent No: 88114687.
D.Y. Wang, 1999, “Synthesis of Diamond-like Carbon Film by Cathodic Arc-Activated PECVD Process “, U.S. Patent No: USSN 09/434,139.
D.Y. Wang, 1999, “Synthesis of Diamond-like Carbon Film by Cathodic Arc-Activated PECVD Process “, China Patent No: 99119465.9.
Chi-Lung Chang, Wan-Yu Wu, Pin-Hung Chen, Wei-Chih Chen, Da-Yung Wang, “DEPOSITION ”, Taiwan. Patent No. I-495746.
Chi-Lung Chang, Wan-Yu Wu, Pin-Hung Chen, Wei-Chih Chen, Da-Yung Wang, “COMPOUND DEPOSITION ”, Taiwan. Patent No. M475016.
Chi-Lung Chang, Wan-Yu Wu, Pin-Hung Chen, Wei-Chih Chen, Da-Yung Wang, “COMPOUND DEPOSITION ”, CHINA. Patent No. ZL201420017179.7.
Da-Yung Wang, Hsuan-Yueh, Chun-Ta Ho, Wei-Chih Chen, “DIE FOR MOLDING GLASS”, Taiwan. Patent No. M438372
Yin-Yu Chang, Shien-Chen Liu, Da-Yung Wang, “AN INTEGRATED CIRCUIT PACKAGE MOLD WITH HIGH HARDNESS AND CORROSION RESISTANT COATING ON THE SURFACE OF THE MOLD”, Taiwan. Patent No. I-319603
Chi-Lung Chang, D.Y. Wang, Shu-Man Li, 2004, “THE METHOD FOR REMOVING DIAMOND-LIKE CARBON FILMS AND ITS PRODUCTS”, Taiwan. Patent No. I-248123.